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Indium Corporation to Showcase High-Reliability Solder Technology at APEX EXPO 2026

CLINTON, N.Y., March 3, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California.

Indium Corporation’s showcased products include:

  • Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability in low-temperature step soldering. It is ideal for assemblies with broad temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 with optimal process setup.
  • Durafuse® HR is a trusted and proven solder paste alloy technology delivering enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
  • Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
  • Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
  • CW-807RS is the next generation of Indium Corporation’s CW-807 formula, a customer-preferred choice for many years. This high-reliability, halide- and halogen-free flux-cored wire improves wetting speeds and cycle times for electronics assembly and robotic soldering applications. Its no-clean formula contains the company’s industry-leading spatter-control technology.
  • CW-818 is a halide-free, no-clean cored wire with spatter-control technology that provides fast wetting speeds to minimize cycle times in manual and robotic soldering processes.

To learn more about Indium Corporation’s high-reliability solder technology, visit indiumstg.wpenginepowered.com or visit our experts at APEX EXPO booth #1038.

인디엄 코퍼레이션 소개

인듐코퍼레이션®(Indium Corporation®)은 글로벌 전자, 반도체, 박막 및 열 관리 시장을 대상으로 하는 선도적인 소재 정제, 제련, 제조 및 공급 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄·주석 금속 및 무기 화합물, 그리고NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국 및 미국에 공장을 운영하고 있습니다.

인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.linkedin.com/company/indium-corporation/에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.