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Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and

Indium Corporation will feature its precision gold alloy solder preforms at SPIE Defense + Commercial Sensing Expo, April 9-13, in Anaheim, Calif. Depending on the alloy, gold-based solders

Indium Corporation will feature its Ball-Attach Flux WS-575-C-RT at Productronica China from March 14-16, 2017, in Shanghai. Indium Corporation's Ball-Attach Flux

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at the IPC APEX Expo technical conference on February 14-16 in San

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March

Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials. Nash is responsible for managing new solder paste product development, including strategy

Seven Indium Corporation partners will exclusively run its low-voiding solder products "Live@APEX" throughout the IPC APEX Expo technical conference on Feb. 14-16 in San

Indium Corporation, Utica’s Technology Company®, is celebrating the service of 61 employees with 10 or more years of employment as of December

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen,

Indium Corporation has named Jim Hisert as Indium Applications Manager. Hisert is responsible for exploring and leveraging the use of indium in various forms and applications. He will

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla. InFORMS are reinforced solder preforms that increase

Indium Corporation will be running its low-voiding solder products "Live@APEX" in more than 20 partner booths throughout the IPC APEX Expo technical conference on Feb. 14-16

Indium Corporation, Utica's Technology Company®, has hired Kim Flanagan to serve as a Technical Support Engineer at the company's headquarters in Clinton. Flanagan provides technical

Indium Corporation has hired Seth Homer as Product Manager for Engineered Solders – IGBT. Homer will specialize in the power electronics markets for engineered solders, including

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead three sessions at the IPC APEX Expo technical conference on February 11-16 in San Diego, Calif.

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Tim Jensen, Senior Product Manager for Engineered Solders Materials, will present

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, has been bestowed the prestigious title of Fellow of the Institute of Electrical & Electronics Engineers (IEEE)

Indium Corporation has released a new solder research kit designed for soldering to gold plating using indium-based alloys. Gold is often used in electronics assembly because it resists

Indium Corporation's Dr. Ron Lasky, Senior Technologist, discusses the importance of indium tin oxide (ITO) in touchscreen and flat panel technology in a new video available

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at NEPCON Japan 2017 on Jan. 18-20 in Tokyo, Japan. Indium8.9HF is specifically formulated