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Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indiums unique halogen-free oxidation barrier technology with optimized

Indium Corporation, Kyzen, and DEK hosted a technical seminar on November 27, 2013 in Manila, Philippines. The seminar, titled Soldering, Cleaning & Machine Efficiency, featured presentations by

Indium Corporation’s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.

Indium Corporation is pleased to announce that Jeff Anweiler has been named business development manager for precious metals products and Leo Devine has been named regional sales manager for the

Indium Corporation is pleased to announce that Pony Liao, area technical manager Northern China, has earned his Six Sigma Black Belt certification through the American Society for Quality. Liao joins

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SMTA certification is one of the electronics assembly industry’s most respected elements of process excellence. 2014 marks the 10th anniversary of the SMTA certification program, as well as the

Indium Corporation announces that Jeff Johnson has joined Indium Corporation as a Product Development Engineer. Johnson is based at Indium Corporation’s global headquarters in Clinton, N.Y.

Die Indium Corporation wurde am 12. November auf der Productronica in München mit dem Global Technology Award für ihre SACm-Lotlegierung ausgezeichnet. Verliehen von der Zeitschrift Global

Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability

Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13 – 14 in Costa Mesa, California. Dr. Ning-Cheng Lee, Vice

Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in

Indium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth,

Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Productronica November 12-15 in Münich, Germany. SACm™ is a high-reliability solder alloy

Indium Corporation continues to expand its existing line of solder products to provide customers with a consistent and reliable supply of soldering materials, thereby allowing customers to

Indium Corporation announces the promotion of two technical managers in the company’s Asia-Pacific operations. Sze Pei Lim has been promoted to Technical Manager for Asia-Pacific Operations.

Indium Corporation was awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate by the IPC Association at the fall IPC Standards Development Committee Meetings. The meetings were

Indium Corporation hosted 45 students and teachers from Herkimer BOCES on October 8 as part of their celebration of National Manufacturing Day. Students toured Indium Corporation’s

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the Materials Science and Technology Conference October 27-31 in Montreal, Canada. Dr. Zhang’s presentation,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday,