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Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in

Indium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth,

Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Productronica November 12-15 in Münich, Germany. SACm™ is a high-reliability solder alloy

Indium Corporation continues to expand its existing line of solder products to provide customers with a consistent and reliable supply of soldering materials, thereby allowing customers to

Indium Corporation announces the promotion of two technical managers in the company’s Asia-Pacific operations. Sze Pei Lim has been promoted to Technical Manager for Asia-Pacific Operations.

Indium Corporation was awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate by the IPC Association at the fall IPC Standards Development Committee Meetings. The meetings were

Indium Corporation hosted 45 students and teachers from Herkimer BOCES on October 8 as part of their celebration of National Manufacturing Day. Students toured Indium Corporation’s

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the Materials Science and Technology Conference October 27-31 in Montreal, Canada. Dr. Zhang’s presentation,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday,

Indium Corporation is celebrating National Manufacturing Day, October 4, 2013, with a variety of activities intended to promote STEM (science, technology, engineering, and math) education and career

Indium Corporation introduces a full line of soldering products that satisfy IPCs J-STD004B. The IPCs new 004B has stricter requirements for measuring halogens and electromigration risk. Indium

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York. Dr.

Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas.

Indium Corporation’s Tim Jensen, Product Manager – PCB Assembly Materials, will give a tutorial at SMTA International (SMTAi) on October 14, in Fort Worth,

Indium Corporation will feature high-reliability gold-based solders at the International Symposium on Microelectronics (IMAPS) September 30 – October 3 in Orlando, Florida. Gold-based solders

Indium Corporation’s Dr. Robert Ploessl, Manager of Market and Technology Assessment and Product Manager for Compounds, will present at the Minor Metals Americas Conference, September 26-27 in

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on

Indium Corporation technology experts will present at the 46th International Symposium on Micro Electronics September 30-October 3 in Orlando, Florida. Dr. Ning-Cheng Lee, Vice President of

Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Productronica November 12-15 in Münich, Germany. SACm™ is a high-reliability solder alloy

Indium Corporations Liyakathali Koorithodi, Senior Technical Support Engineer, will present at the launch of a new SMTA chapter in Bangalore, India on September 25. Liyakathalis presentation,

The Surface Mount Technology Association (SMTA)s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt