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Indium Corporation announces that Robert Ploessl, PhD, has been named Product Manager for indium, gallium, germanium and tin compounds. In this new position,

Indium Corporation announces that Eugene Davies has been named applications engineer. He will be based at Indium Corporation’s Milton Keynes, UK, location. Eugene provides a wide range of

Indium Corporation has acquired a new manufacturing facility, located at 5836 Success Drive, Rome, NY, USA. The plant is currently being outfitted to expand production capacities of Indium

Indium Corporation announces that David Socha has been named Marketing and Technology Specialist. David analyzes and monitors adjacent markets for relevant technology developments. He also assesses

Indium Corporation experts will present their technical findings at the IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging May 22-23, in

Indium Corporation Northeast Technical Support Engineer Amanda Hartnett will present her technical findings at IMAPS NE 39th Symposium & Expo on May 8, 2012, in Boxborough,

Indium Corporation Director of Business Development and Printed Circuit Board Assembly products Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference,

Indium Corporation‘s Vice President of Technology Dr. Ning-Cheng Lee and Product Manager of PCB Assembly Materials Tim Jensen will present their technical findings at the SMTA South East Asia

Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen was recently recognized at IPC APEX Expo for his contributions to the electronics manufacturing industry and for contributing

Indium Corporation‘s Technical Manager for Europe, Karthik Vijay, will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.

Indium Corporation‘s Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6-8, 2012 in Scottsdale/Fountain Hills,

Indium Corporation‘s European Sales Manager for Metals, Compounds, and Solar Products Malcolm Harrower delivered a presentation to guests at Metal Bulletin’s Minor Metals Conference on

Indium Corporation announces that Kathy Screeder has joined the Metals & Compounds and Solar business units as a Commercial Specialist for compounds and solar. Kathy provides global support and

Several Indium Corporation technology experts will share their technical expertise at APEX in San Diego, California, February 28-March 1, 2012. Ning-Cheng Lee, PhD, Vice President of Technology High

Indium Corporation announces that Erin Bonk has been hired as an Account Specialist. Erin is responsible for supporting the internal and external sales teams for the Northeastern part of the USA and

Indium Corporation announces the promotion of Eric Bastow to Assistant Technical Manager. In this position, Eric provides oversight to the Technical Support Team through leadership, advice, technical

Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen will present Material and Process Optimization for Head-in-Pillow Elimination as part of SMTA’s webinar series January

Indium Corporation announces that Greg Wade has been hired as Technical Support Engineer for the Global Accounts Group. Greg provides global technical support for Indium’s multi-national

Indium Corporation‘s Global Product Manager, Andy C. Mackie, PhD, MSc, is presenting at the Surface Mount Technology Association (SMTA) Arizona-Sonora Expo and Tech Forum, December 7, 2011 in

Indium Corporation announces the promotion of Chris Nash to Technical Support Engineer for the Global Accounts Group. In this new position, Chris’s technical responsibilities have been expanded

Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen will present Lead-Free Assembly for High Yields and Reliability as part of SMTA’s webtorial series on December 6 and 13,