フリップチップやBGA の下のはんだ接合部の形状は、合金の表面張力、使用するフラックスの活性、リフロー中の部品への張力や圧縮、およびはんだマスク開口部のサイズによって制御されます。ソルダーマスクの開口部が小さすぎる場合、はんだ接合部の濡れはパッドの小さな領域に限定されます。マスクの開口部が大きすぎる場合、はんだがパッドの隣のトレースに濡れるのを止めるものは何もありません。
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