Indium Corporation
Andy Mackie, PhD, MSc
Indium Corporation
Principal Engineer, Advanced Materials
As Principal Engineer for Advanced Materials, Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly.
Dr. Mackie holds a PhD in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in physical chemistry and surface science from the University of Bristol, UK.
Dr. Mackie is an invited international keynote speaker. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation.
He is an alumnus of the UC Berkeley Product Management program (2015) and the RIT Kate Gleason College of Engineering Short Course in IC Processing (2003).
Current Industry Involvement (2024):
- Board of Directors of iNEMI
- Technical Advisory Board of IEEC/S3IP
- Technical council of Automotive Electronics Council (AEC)
- Lead of iMAPS Heterogeneous Integration Terminology Team (HITT)
- Power Semiconductor Manufacturers Association (PSMA) Packaging Committee
- IEEE EPS Thermomechanical Technical Committee
- Founding member of SEMI Advanced Packaging and Heterogeneous Integration (APHI) standards committee
- SEMI North East USA Regional Committee
- Member of IEEE: PELS, PES, TEMS, Photonics Societies
Industry Awards:
- IMAPS Fellow (2014)
- IMAPS William D. Ashman Achievement Award (2014) for leadership and technical contributions to the semiconductor packaging industry
- IPC President’s Award (2001) for leadership in the Solder Paste Task Group, and the Assembly and Joining Materials sub-committee