Indium Corporation Expert to Present at EPP InnovationsFORUM Germany
February 12, 2020
Markets for electronic devices and assemblies are currently undergoing rapid change due to ever-shorter development times in the industrial and automotive sectors. In his presentation, Individual Electronic Products Require Innovative Solder Materials: New Solder Materials Adapted for Temperature Application Areas, Karch examines how new high-performance applications, such as "multicopters" and semi-autonomous vehicles, are driving demands for new high-reliability solder alloys.
Karch shares process knowledge with and makes technical recommendations for the use of Indium Corporation's materials to customers in Germany, Austria, and Switzerland, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience in PCB and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch is an ECQA-certified integrated design engineer and holds a Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation's commitment to providing world-class service to our customers in Europe.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium, or @IndiumCorp.