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Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM

April 23, 2014

Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany.

Heat-Spring® is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under repeated power cycling.

Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.

For more information about Heat-Spring® thermal interface materials, visit, or stop by to talk to any of Indium Corporation’s technical experts at PCIM, stand 7-454.

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