Indium Corporation earned Electronics Manufacturing (EM) Asia's Innovation Award for its Indium10.1HF Solder Paste. The award was presented in Shanghai, China, during NEPCON China.
The EM Asia Innovation Award program recognizes and celebrates excellence in the Asian electronics industry, encouraging companies to achieve the highest standards and push the industry forward.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies. It increases the reliability of solder joints due to low-voiding, high ECM performance, and solder beading minimization. Together, these qualities enable customers to reduce overall costs associated with end-of-line rework and electrical/thermal reliability that could result in field failures.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte für Elektronik, Halbleiter, Dünnschichten und Wärmemanagement. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
