Indium Corporation earned Electronics Manufacturing (EM) Asia's Innovation Award for its Indium10.1HF Solder Paste. The award was presented in Shanghai, China, during NEPCON China.
EM Asia 创新奖计划旨在表彰亚洲电子行业的卓越成就，鼓励企业达到最高标准，推动行业发展。
Indium10.1HF 是一种空气回流、免清洗、无卤素、无铅焊膏，专门用于实现超低空泡，尤其是在底部终端元件 (BTC) 组装中。由于具有低空洞、高 ECM 性能和焊珠最小化等特性，它能提高焊点的可靠性。这些特性使客户能够降低与生产线末端返工和可能导致现场故障的电气/热可靠性相关的总体成本。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
