Indium Corporation earned Electronics Manufacturing (EM) Asia's Innovation Award for its Indium10.1HF Solder Paste. The award was presented in Shanghai, China, during NEPCON China.
EM Asia 创新奖计划旨在表彰亚洲电子行业的卓越成就，鼓励企业达到最高标准，推动行业发展。
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies. It increases the reliability of solder joints due to low-voiding, high ECM performance, and solder beading minimization. Together, these qualities enable customers to reduce overall costs associated with end-of-line rework and electrical/thermal reliability that could result in field failures.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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