Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA.
Homer will present Materials and Techniques for Void Reduction Under Bottom Termination Components. The paper discusses how voiding is challenging demands for increased reliability and performance, especially as the industry moves toward new 5G platforms. As a solution to excessive voiding between the thermal pad on the QFN and PWB pad, he examines how Indium Corporation’s flux-coated solder preforms have been used to significantly reduce voiding while providing extra benefits to enhance final product reliability.
Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
For more information on Indium Corporation’s flux-coated solder preforms, visit indiumstg.wpenginepowered.com/flux-coated-preforms or visit Indium Corporation’s booth #691.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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