Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.
InFORMS® are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability. They also allow for exceptionally low voiding in solder joints, making them well-suited for IGBT assembly of the DBC to the baseplate.
InFORMS® maintain the highest thermal and electrical conductivity, as compared to typical soldered interconnections. By controlling the bondline thickness, the thermal performance is also more repeatable from device to device.
InFORMS provide engineers with an enhanced material for the development of new applications, or the improvement of existing ones. For more information about InFORMS®, visit indiumstg.wpenginepowered.com/thermal-interface-materials, email [email protected] or visit Indium Corporation at NEPCON booth #13.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
