Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.
InFORMS® are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability. They also allow for exceptionally low voiding in solder joints, making them well-suited for IGBT assembly of the DBC to the baseplate.
InFORMS® maintain the highest thermal and electrical conductivity, as compared to typical soldered interconnections. By controlling the bondline thickness, the thermal performance is also more repeatable from device to device.
InFORMS provide engineers with an enhanced material for the development of new applications, or the improvement of existing ones. For more information about InFORMS®, visit www.indium.com/thermal-interface-materials, email [email protected] or visit Indium Corporation at NEPCON booth #13.
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
