Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Electronic Components and Technology Conference (ECTC) May 26-29 in San Diego, Calif.
Dr. Lee's presentation, Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process, reviews the use of a newly-developed nano-Ag paste that allows for a pressureless sintered die-attach process. This process creates sintered joints that exhibit very low porosity, high joint shear strength, and very good electrical and thermal conductivity.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
ECTC is a premier international event that brings together the best in packaging, component, and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
