블로그

제품

Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling: Part I

In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a

제품

Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling Part II

As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.

제품

밀로쉬 라지치와 함께하는 액체 금속 실험(4부)

밀로쉬 라지치와의 대화를 마무리하기 위해 오늘 다시 돌아왔습니다. 처음 세 부분을 놓치셨다면 여기에서 다시 시작 부분으로 돌아가세요. Jim: 이 자료에 대해 어떤 점이 흥미로우신가요?

제품

Liquid Metal Experimentation with Miloš Lazić (Part 3)

Yesterday, in Part 2 ofour interview, Miloš mentioned how using a hybrid solid/liquid TIM provides benefits over thermal grease. Today we discuss the challenges to working with liquid metal,

아카이브

Liquid Metal Experimentation with Miloš Lazić (Part 2)

In yesterday’s post, Miloš and I discussed what he’s been working on in the

제품

Liquid Metal Experimentation with Miloš Lazić (Part 1)

I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and

제품

Engineering Drawing / Specifications for Pure Indium Preforms

It may seem obvious that we need dimensions on an engineering drawing to specify a solder preform, but we often receive drawings with missing dimensions or tolerances. I’m guilty of that too

제품

SEM 분석을 통해 솔더 접합부를 특성화하는 방법

Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection

제품

굶주림 무효화: 너무 적은 양(페이스트)이 너무 많은 양(무효화)이 되는 경우

처음 QFN 보이드에 대해 접했을 때는 플럭스에서 가스가 빠져나가면 갇힌 공기 주머니가 생겨 신뢰성 문제를 일으키는 간단한 문제인 것처럼 보였습니다. 하지만 이후 저는

제품

Why Do We Need to Go Thinner?

For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability. Typical applications for 80Au20Sn in die-attach

아카이브

Statistically Significant versus Practically Significant in SMT Data Collection

Folks, Let’s assume your company has decided that transfer efficiency (TE) is the key metric in determining solder paste quality. Transfer efficiency is the ratio of the volume of the solder

제품

Durafuse® LT - 저온 리플로

Low-temperature solders can have a wide variety of reflow profiles. One of the great things about Durafuse® LT is that it opens up an entirely new set of options for combining low oven

제품

Don’t Get Burned: How to Avoid Flux Charring

Flux charring isan undesirable cosmetic defect and one of the more common issues in hand and robotic soldering operations. There are multiple factors that can contribute to the charring of flux in

제품

The Five Ball vs Eight Ball Rules in SMT Solder Paste Printing

Michel writes: Dr. Ron, when if comes to SMT printing of solder paste, why do some people use the five-ball rule for rectangular apertures and the eight-ball rule for circular apertures? Michel: The

제품

Durafuse® LT – A New Relationship with Liquidus

When you are choosing a low temperature solder alloy, there are some key properties that you should to consider. The first, and most important, is the melting temperature.This is commonly referred to

제품

Durafuse® LT – Drop-shock

I recently wrote a blog about this fascinating new low temperature solder technology – Durafuse® LT, but I have to admit that no matter how interesting a new technology might be, it is

제품

Indalloy® 292 – High Reliability Alloy

Isn't it interesting that "high reliability" gets to be its very own category of solder paste?The very definition of reliability is "the quality of being trustworthy or of

제품

Durafuse® LT – New Mixed Low Temperature Solder Technology!

Being arecent addition to the PCBA (printed circuit board assembly) solder team at Indium Corporation, it has been eye opening to see how much change is possible in a field that from the outside

지원

반도체 플럭스: 파트 3

이번 글은 반도체 플럭스에 대한 시리즈 3부입니다. 반도체 플럭스에 대해 처음 배우는 사람이라면 이 포스팅을 통해 플럭스의 작동 원리를 더 잘 이해할 수 있을 것입니다. 가장 중요한

제품

반도체 플럭스: 2부

이번 글은 반도체 플럭스에 대한 시리즈의 두 번째 파트입니다. 이 주제에 대한 첫 번째 블로그 포스팅을 아직 보지 않으셨다면 지금 읽어보시기 바랍니다. 먼저 반도체 플럭스에 대해 좀 더 자세히 살펴보겠습니다.

제품

반도체 플럭스: 1부

반도체 제품에 익숙하지 않은 많은 사람들이 반도체 제품을 어렵게 생각합니다. 저도 그런 사람 중 한 명이었지만, 이제는 반도체 플럭스가 어렵게 느껴져서는 안 된다는 것을 깨달았습니다.

Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.