Indium Corporation’s David Sbiroli, R&D Senior Technologist, will participate in a Global SMT & Packaging debate on advanced print and paste deposition techniques on Tuesday, Oct. 6 at 7:45 am Pacific Time, 10:45 am Eastern Time, 3:45 pm British Time, 4:45 pm Central European Time.
Achieving the perfect solder paste volume in the print process can have a direct impact on solder joint reliability. In this Global SMT & Packaging webinar, participants will discuss the do’s and don’ts of printer setup, stencil design, and paste deposition to increase solder joint reliability in the assembly process.
토론 후에는 실시간 Q&A 세션이 이어집니다.
For more information or to register for the debate, visit https://bit.ly/3c4vzDu.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at indiumstg.wpenginepowered.com/webinar.
In his role as R&D Senior Technologist, Sbiroli characterizes soldering materials’ critical performance attributes and assists in the development of new materials and accelerated test methods to augment performance needs. To fulfill this, he utilizes more than 25 years of hands-on experience in the selection and applications of PCBA materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of customers’ SMT and electronic assembly production lines. Sbiroli joined Indium Corporation in 1993 and previously held the position of Technical Manager of Global Accounts, where he was responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key multinational accounts. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam, and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
