Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer and PCB Assembly Materials Specialist, will present at the SMTA Ohio Valley Solder Roundtable on November 6 at Corporate College East, Warrensville Heights, Ohio.
As the use of bottom termination components (BTCs) quickly increases in electronics assemblies, it is common for a single assembly to be composed of varying types of BTCs. Sandy-Smith will discuss how to manage scenarios when one or more of the BTCs starts to show increased variation in the same process. She will also explore process modifications and improved pad design strategies that help alleviate BTC voiding, as well as emerging IPC recommendations for design and implementation of BTCs, particularly in regard to IPC-7093.
Sandy-Smith is an SMTA Certified Process Engineer and specializes in PCB Assembly Materials. She is active in IPC committees, SMTA programs and iNEMI projects, and currently serves as chair of the J-STD-004 committee and VP of technical programs for the SMTA Empire chapter. Sandy-Smith graduated from the International Engineering Program at the University of Rhode Island in Chemical Engineering and German language.
SMTA는 마이크로시스템, 신흥 기술 및 관련 비즈니스 운영을 포함한 전자 조립 기술 분야에서 기술을 구축하고, 실무 경험을 공유하며, 솔루션을 개발하는 전문가들의 국제적인 네트워크입니다.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
