Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer and PCB Assembly Materials Specialist, will present at the SMTA Ohio Valley Solder Roundtable on November 6 at Corporate College East, Warrensville Heights, Ohio.
As the use of bottom termination components (BTCs) quickly increases in electronics assemblies, it is common for a single assembly to be composed of varying types of BTCs. Sandy-Smith will discuss how to manage scenarios when one or more of the BTCs starts to show increased variation in the same process. She will also explore process modifications and improved pad design strategies that help alleviate BTC voiding, as well as emerging IPC recommendations for design and implementation of BTCs, particularly in regard to IPC-7093.
Sandy-Smith is an SMTA Certified Process Engineer and specializes in PCB Assembly Materials. She is active in IPC committees, SMTA programs and iNEMI projects, and currently serves as chair of the J-STD-004 committee and VP of technical programs for the SMTA Empire chapter. Sandy-Smith graduated from the International Engineering Program at the University of Rhode Island in Chemical Engineering and German language.
SMTAは、マイクロシステム、新興技術、関連事業運営を含むエレクトロニクス組立技術において、スキルを構築し、実務経験を共有し、ソリューションを開発する専門家の国際的なネットワークです。
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
