Indium Corporation‘s Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, Voiding Control for QFN Assembly, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, January 18-20, 2011.
Voiding Control for QFN Assembly will explore advanced technology solutions for reduced voiding. The paper will be presented as part of session TA2: Materials Advances: Connections Tuesday, January 18th.
Indium Corporation is also a sponsor of the symposium.
Sponsored by the SMTA, the Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. For more information visit, www.smta.org/panpac/.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Dr. Lee resides in Clinton, NY.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터 타겟, 인듐, 갈륨, 게르마늄 화학물질 및 소싱, 반응성 나노포일® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
