Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders,will present at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom.
Leavitt will present The Impact of AuSn Preforms’ Thickness on Solder Joint Reliability, which discusses how to overcome the diminishing power of semiconductor lasers as their operational heat increases during use. One technque utilized to counteract this challenge is the application of a thinner 80Au20Sn solder joint for die-attach to aid in thermal transfer to the copper heat sinks. Leavitt will review the results of a study designed to help engineers gain insight into the optimal preform thickness for laser diode applications, as well as other die-attach applications.
Leavitt is responsible for marketing Indium Corporation’s product line for high-temperature applications. He helps customers who are looking for high-temperature soldering solutions to identify the right products for their assembly needs. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College. He’s scheduled to complete his Master of Business Administration in Business Management from Empire State in 2020.
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