Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders,will present at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom.
Leavitt will present The Impact of AuSn Preforms’ Thickness on Solder Joint Reliability, which discusses how to overcome the diminishing power of semiconductor lasers as their operational heat increases during use. One technque utilized to counteract this challenge is the application of a thinner 80Au20Sn solder joint for die-attach to aid in thermal transfer to the copper heat sinks. Leavitt will review the results of a study designed to help engineers gain insight into the optimal preform thickness for laser diode applications, as well as other die-attach applications.
Leavitt is responsible for marketing Indium Corporation’s product line for high-temperature applications. He helps customers who are looking for high-temperature soldering solutions to identify the right products for their assembly needs. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College. He’s scheduled to complete his Master of Business Administration in Business Management from Empire State in 2020.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
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