Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials,will present at the Semi-Therm 35thAnnual Symposium & Exhibit, March 18-22, in San Jose, Calif., USA.
Jensen’s presentation entitled Innovative Liquid Metal Thermal Interface Technology for TIM2 Applicationswill examine the methodologies and techniques that can enable liquid metal to be used in a higher array of TIM1, TIM1.5, and TIM2 applications. Jensen will also address the processing challenges of using a liquid metal.
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in businessadministration from Syracuse University.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
