Several Indium Corporation experts will share their knowledge and expertise at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 – Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
The following technical papers authored by Indium Corporation experts will be featured:
- Voiding Control in Preform Soldering by Dr. Ning-Cheng Lee, Vice President of Technology
- Avoid the Void® by Edward Briggs, Senior Technical Support Engineer
- Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs by Maria Durham, Technical Support Engineer, Semiconductor and Advanced Assembly Materials; and Brandon Judd, Technical Support Engineer, Southwest/Rocky Mountains U.S.
- Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors by Tim Jensen, Product Manager for Engineered Solders Materials; and David Saums of DS&A LLC
- Challenges in Fine-Feature Solder Paste Printing for SiP Application by Sze Pei Lim, Semiconductor Product Manager – Southeast Asia; and Kenneth Thum, Senior Technical Support Engineer
Additionally, Dr. Ning-Cheng Lee is teaching two professional development courses:
- Achieving High Reliability Lead-Free Solder Joints – Materials Consideration
- It is Time for Low Temperature – Low Temperature Solders, New Developments, and Their Applications
To register for the IMAPS conference, visit: www.imaps.org/imaps2016/.
Indium Corporation은 전 세계 전자, 반도체, 박막, 열 관리 및 태양광 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
