Several Indium Corporation experts will share their knowledge and expertise at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 – Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
The following technical papers authored by Indium Corporation experts will be featured:
- Voiding Control in Preform Soldering by Dr. Ning-Cheng Lee, Vice President of Technology
- Avoid the Void® by Edward Briggs, Senior Technical Support Engineer
- Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs by Maria Durham, Technical Support Engineer, Semiconductor and Advanced Assembly Materials; and Brandon Judd, Technical Support Engineer, Southwest/Rocky Mountains U.S.
- Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors by Tim Jensen, Product Manager for Engineered Solders Materials; and David Saums of DS&A LLC
- Challenges in Fine-Feature Solder Paste Printing for SiP Application by Sze Pei Lim, Semiconductor Product Manager – Southeast Asia; and Kenneth Thum, Senior Technical Support Engineer
Additionally, Dr. Ning-Cheng Lee is teaching two professional development courses:
- Achieving High Reliability Lead-Free Solder Joints – Materials Consideration
- It is Time for Low Temperature – Low Temperature Solders, New Developments, and Their Applications
To register for the IMAPS conference, visit: www.imaps.org/imaps2016/.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
