Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb. 1-6, in San Diego, Calif., USA.
The following technical papers from Indium Corporation experts will be featured:
- Novel TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- Enhanced Cleanability Using Fluxes with Decreased Viscosity After Reflow by Dr. Lee
- Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA? by Kim Flanagan, Technical Support Engineer
- Optimizing the Robotic Soldering Process by Robert McKerrow, Product Specialist
Additionally, Claire Hotvedt, Product Development Specialist, will present her poster, Durafuse™ LT–A Mixed Alloy Solution for Low-Temperature Drop Shock.
Miloš Lazi, Technical Support Engineer, will moderate the technical conference session S05: Advances in Dispensing.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 이메일 ([email protected])로 문의하세요 . 또한 From One Engineer To Another® (#FOETA)의 전문가를 www.facebook.com/indium 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
