Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif.
인듐10.1은 납이 함유되지 않은 할로겐 함유 솔더 페이스트로, 넓은 접지면을 가진 QFN, BGA 및 패드에 가장 낮은 수준의 보이드가 발생합니다.
The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 offers the lowest cost of ownership to PCB assembly manufacturers through best-in-class printing and soldering performance, including best-in-class print definition and transfer efficiency, low-voiding performance, and head-in-pillow and graping resistance.
Indium Corporation will be exhibiting at booth 1027.
For more information about Indium10.1 or Indium Corporation's complete Pb-free Solder Paste series, visit www.indium.com/indium10.1, or email [email protected].
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
