Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif.
Indium10.1是一种无铅含卤素焊膏，对于 QFN、BGA 和带大接地平面的焊盘，其空洞度最低。
The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 offers the lowest cost of ownership to PCB assembly manufacturers through best-in-class printing and soldering performance, including best-in-class print definition and transfer efficiency, low-voiding performance, and head-in-pillow and graping resistance.
Indium Corporation will be exhibiting at booth 1027.
For more information about Indium10.1 or Indium Corporation's complete Pb-free Solder Paste series, visit www.indium.com/indium10.1, or email [email protected].
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。
