Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Surface Mount Technology Association International (SMTAi) October 15-17 in Fort Worth, Texas.
SACm™ is a high-reliability solder alloy that offers drop-shock test performance far superior to other SAC alloys, without compromising on thermal cycling. Its low silver content makes it a cost-effective solution for portable electronics.
이 플랫폼은 기판 측 상호 연결을 위해 특허 출원 중인 Indium Corporation의 SACm™ 솔더 합금 기술을 사용하는 Indium8.9 시리즈 솔더 페이스트와 패키지 레벨 상호 연결을 위한 SACm™ 솔더 볼(구체)로 구성됩니다.
Dr. Ning-Cheng Lee, Vice President of Technology, said, SACm™ offers a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions.
“We see a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions,” Dr. Lee said. “These micro-structural improvements translate into an 8X (800%) improvement in drop-shock performance and 50% extension in thermal cycling.”
SACm™ is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength. The reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
Indium Corporation will be exhibiting at booth 318.
For more information about Indium Corporation’s SACm™ solder paste, visit SACm or email [email protected].
