Indium Corporation’s Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.
Durham’s presentation, Solderability Challenges in Emerging BGA Packages, details the sequence of processes seen in typical BGA assembly and examines the effects of each set of prior processes on the solderability of the final pad.
For more information about Maria’s presentation or to register for the conference, visit www.imaps.org/devicepackaging.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar performing research in electro-chemical deposition.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, and professional development courses. IMAPS currently has more than 8,000 national and international members. For more information or to register for the event, visit www.imaps.org/devicepackaging.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
