Indium Corporation's Jacques Matteau, sales and technical support manager, will share his expertise at the American Welding Society's 2015 International Brazing & Soldering Conference (IBSC) on April 19 in Long Beach, Calif.
Matteau will instruct the professional development course, A Novel Method of Managing Joint Stress in a Metallic Bond Using Reactive Multilayer Foils at a User-Selected Temperature. During this course, Matteau will explain how to effectively minimize and manage joint stress by using a reactive multilayer foil, commercially known as NanoFoil®, to create the bond. This is especially useful for large area applications, where the mechanical methods used to flatten deformations are unpredictable and cause yield loss.
Matteau has more than 20 years of experience with thin-film technologies and the electronics industry. He has a strong technical materials background with a degree in physical chemistry and materials science from the University of Ottawa. Matteau started his career as a technologist with a specific emphasis on ceramics technologies and braze bonding.
The IBSC provides professionals, scientists, and engineers involved in the research, development, and application of brazing and soldering, a unique networking and idea-exchanging forum. The three-day conference provides cutting-edge education and technical programming, as well as peer networking and a full exhibit program, showcasing the latest trends, products, processes, and techniques available in the industry.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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