Indium Corporation's Jacques Matteau, sales and technical support manager, will share his expertise at the American Welding Society's 2015 International Brazing & Soldering Conference (IBSC) on April 19 in Long Beach, Calif.
Matteau will instruct the professional development course, A Novel Method of Managing Joint Stress in a Metallic Bond Using Reactive Multilayer Foils at a User-Selected Temperature. During this course, Matteau will explain how to effectively minimize and manage joint stress by using a reactive multilayer foil, commercially known as NanoFoil®, to create the bond. This is especially useful for large area applications, where the mechanical methods used to flatten deformations are unpredictable and cause yield loss.
Matteau has more than 20 years of experience with thin-film technologies and the electronics industry. He has a strong technical materials background with a degree in physical chemistry and materials science from the University of Ottawa. Matteau started his career as a technologist with a specific emphasis on ceramics technologies and braze bonding.
The IBSC provides professionals, scientists, and engineers involved in the research, development, and application of brazing and soldering, a unique networking and idea-exchanging forum. The three-day conference provides cutting-edge education and technical programming, as well as peer networking and a full exhibit program, showcasing the latest trends, products, processes, and techniques available in the industry.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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