Indium Corporation's Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present at the SMART Group’s seminar, Reliability and Standards in Real Life: An IPC and SMART Group Perspective, on Sept. 11 in Swindon, U.K.
Vijay will present The Effect of Reflow Profiling on the Electrical Reliablity of No-Clean Solder Paste Flux Residues. This paper discusses the outcomes of a study that applied IPC J-STD-004 surface insulation resistance (SIR) testing to a halogen-free (ROL0) and a halogen-containing (ROL1) Pb-free, no-clean solder paste to determine and compare the effects of reflow profiling on electrical reliability.
Vijay is based in the U.K. and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
