Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe, June 5-7, in Nuremberg, Germany.
Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder with a reinforcing matrix. This combination increases lateral strength and improves bondline co-planarity, providing superior thermal cycling reliability.
InFORMS® do more than just bond two surfaces. These solder preforms were designed to address some specific challenges to the power electronics industry.
InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information about InFORMS®, visit www.indium.com/informs or visit us at booth #7-528.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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