Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at ICEPT 2015, August 11-14 in Changsha, China.
Dr. Lee’s first presentation, Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions, will discuss a new halogen-free no-clean SnAgCu solder paste that has been developed to address the reliability issues caused by insufficiently dried or burnt-off flux residue that can affect reliability.
Achieving High Reliability Via Pressureless Sintering of Nano-Ag Paste for Die-Attach reveals the results of developing a nano-Ag sintering paste designed for a pressureless sintering process under air. The paste was tested in different sintering temperatures and evaluated for porosity and effects of thermal aging.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
ICEPT 2015 is a four-day event featuring the latest technological developments in electronics packaging, manufacturing and packaging equipment, and emerging research and development trends. For information, visit www.icept.org.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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