Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, shared his expertise during two professional development courses at the 19th International Conference on Electronic Packaging Technology (ICEPT 2018) on Aug. 8 in Shanghai, China.
Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration detailed the material considerations required for achieving high-reliability in lead-free solder joints. The goal of this course was to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
The second course, Power Electronic Packaging Reliability, Materials, Assembly and Simulation, educated participants on the lead-free materials best used to achieve high-reliability solder joints in power electronics at varying temperatures.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
