Indium Corporation technology experts will present at the 46th International Symposium on Micro Electronics September 30-October 3 in Orlando, Florida.
Dr. Ning-Cheng Lee, Vice President of Technology, will present Reliability of Low Melting Mixed Lead-Free BGA Assembly. This presentation examines BGAs with SAC105, SAC305, and BiSnAg balls assembled with SAC105, SAC305, or 57Bi42Sn1Ag solder paste. Their joint mechanical strength, drop test performance, and voiding performance were evaluated against their reflow profile.
Dr. Lee will also present A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped POP. In this presentation, Dr. Lee discusses a newly-developed epoxy flux, compatible with solder paste, to address the drop failure of area array packages, such as BGAs, CSPs, and POP.
Additionally, Dr. Lee will give a professional development course, titled Package-on-Package Technology What It Is, What Works, and What Doesnt Work. This course covers package-on-package technology. Topics include trends, designs, material selection, processes, and reliability.
Dr. Ron Lasky, Senior Technologist, will co-chair the Pb-free Solder & RoHS session. Maria Durham, Product Support Specialist Semiconductor and Advanced Assembly Materials, will co-chair the Bonding Materials and Processes session.
이 박사는 세계적으로 유명한 납땜 전문가이자 SMTA 우수 회원입니다. 그는 고온 폴리머, 마이크로 일렉트로닉스용 인캡슐런트, 언더필 및 접착제 개발 분야에서 폭넓은 경험을 보유하고 있습니다. 현재 그의 연구 분야는 전자 및 광전자 애플리케이션을 위한 인터커넥트 및 패키징용 첨단 소재이며, 고성능과 낮은 소유 비용에 중점을 두고 있습니다.
Dr. Lasky, holder of the prestigious SMTA Founders Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Durham serves as a technical liaison between Indium Corporations customers and internal departments, such as sales, technical support, research and development, and operations to ensure the best quality and selection of products. She earned her bachelors degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar focusing on electro-chemical deposition research.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions that bring together the entire microelectronics supply chain. Events and products focus on those technologies critical to the present and future of microelectronics: 3D integration, MEMS, flip chip, wafer level packaging, thermal management, printed electronics, advanced materials, photonics, modeling/design, as well as many others.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
