Indium Corporation technology experts will present at the 46th International Symposium on Micro Electronics September 30-October 3 in Orlando, Florida.
Dr. Ning-Cheng Lee, Vice President of Technology, will present Reliability of Low Melting Mixed Lead-Free BGA Assembly. This presentation examines BGAs with SAC105, SAC305, and BiSnAg balls assembled with SAC105, SAC305, or 57Bi42Sn1Ag solder paste. Their joint mechanical strength, drop test performance, and voiding performance were evaluated against their reflow profile.
Dr. Lee will also present A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped POP. In this presentation, Dr. Lee discusses a newly-developed epoxy flux, compatible with solder paste, to address the drop failure of area array packages, such as BGAs, CSPs, and POP.
Additionally, Dr. Lee will give a professional development course, titled Package-on-Package Technology What It Is, What Works, and What Doesnt Work. This course covers package-on-package technology. Topics include trends, designs, material selection, processes, and reliability.
Dr. Ron Lasky, Senior Technologist, will co-chair the Pb-free Solder & RoHS session. Maria Durham, Product Support Specialist Semiconductor and Advanced Assembly Materials, will co-chair the Bonding Materials and Processes session.
リー博士は世界的に著名なはんだ付けの専門家であり、SMTAの特別会員でもある。高温ポリマー、マイクロエレクトロニクス用封止材、アンダーフィル、接着剤の開発に豊富な経験を持つ。現在の研究テーマは、エレクトロニクスおよびオプトエレクトロニクス用途の相互接続およびパッケージング用先端材料で、高性能と低所有コストの両方に重点を置いている。
Dr. Lasky, holder of the prestigious SMTA Founders Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Durham serves as a technical liaison between Indium Corporations customers and internal departments, such as sales, technical support, research and development, and operations to ensure the best quality and selection of products. She earned her bachelors degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar focusing on electro-chemical deposition research.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions that bring together the entire microelectronics supply chain. Events and products focus on those technologies critical to the present and future of microelectronics: 3D integration, MEMS, flip chip, wafer level packaging, thermal management, printed electronics, advanced materials, photonics, modeling/design, as well as many others.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウムの金属および無機化合物、NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
