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June 3, 2025

Indium Corporation Joins Virginia Tech Center for Power Electronics Systems Industry Consortium

Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia

May 29, 2025

Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025

Indium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave

May 27, 2025

Indium Corporation Promotes O’Leary to Director of Global Accounts

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to electronics, semiconductor, thin-film, and thermal management industries, announces the promotion of Brian

May 22, 2025

Indium Corporation to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component

May 19, 2025

Indium Corporation to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May

May 7, 2025

Indium Corporation and Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership

Indium Corporation and Rio Tinto today announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement

May 6, 2025

Indium Corporation Expert to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference

Indium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh

May 1, 2025

Indium Corporation Wins EM Asia Innovation Award

Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse®

April 23, 2025

Congressman John W. Mannion Visits Indium Corporation to Discuss Supply Chain Challenges for Critical Materials, Workforce Development, and U.S. Manufacturing Strength

Indium Corporation® was pleased to welcome U.S. Congressman John W. Mannion (NY-22) to its Business Park Drive facility in Utica, New York, for a site visit showcasing the company’s global

April 17, 2025

Indium Corporation Experts to Present on Power Electronics at PCIM Europe 2025

As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of

April 15, 2025

Indium Corporation to Feature Materials Solutions Powering Sustainability at PCIM Europe

As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at PCIM Europe, taking

April 2, 2025

Indium Corporation Earns Two New Product Awards for High-Reliability Flux-Cored Wire and Solder Alloy

Indium Corporation, a leading materials provider for the electronics assembly market, recently earned two CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for its high-reliability alloy used

March 25, 2025

인디엄 코퍼레이션, 프로덕트로니카 차이나에서 입증된 전기차 제품 및 고신뢰성 합금 선보여 

As a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions

March 25, 2025

Indium Corporation to Showcase Innovative Materials Powering AI Technology at Productronica China 

As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs)

March 19, 2025

Dr. Yan Liu of Indium Corporation Named as MACNY’s 2025 Innovator of the Year

Syracuse, NY – MACNY, The Manufacturers Association, is proud to announce Dr. Yan Liu, Director of Global Research and Development (R&D) at Indium Corporation, as the recipient of the 2025

March 10, 2025

Indium Corporation, Industry Partners to Showcase Products “Live@APEX”

Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in

March 6, 2025

Indium Corporation Experts to Present on Solder and Thermal Solutions at APEX 2025

As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related

March 5, 2025

Indium Corporation to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025

Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim,

March 3, 2025

Indium Corporation Powering Sustainability at APEC 2025 

As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at APEC 2025, taking

February 28, 2025

Indium Corporation to Feature New Heat-Spring® Metal TIM at SEMI-THERM 2025

Indium Corporation® will feature its lineup of high-reliability, low-temperature thermal interface material (TIM) products at SEMI-THERM 2025, taking place March 10-14 in San Jose, California. 

February 26, 2025

Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test at TestConX

Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX