보도 자료

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, delivered a keynote presentation at the Electronics Packaging Symposium at Binghamton University on Oct. 8.

Indium Corporation's Aaron Yan, area technical manager – eastern China, will share his expertise at an IPC Seminar on Oct. 29 in Suzhou,

Indium Corporation's Derrick Herron, technical support engineer, will present at the American Society of Mechanical Engineers (ASME) meeting on Oct. 28 at 6 p.m. at the Spaghetti

Indium Corporation, Kyzen Corporation, Heller Industries, Inc., and MBtech Group hosted a technical conference on Oct. 17 in Melaka, Malaysia. The conference featured technical presentations from Sze

Indium Corporation announces that Tim Hults has joined their team as technical support engineer for Global Accounts. He is based out of the Indium Corporation Global Headquarters in Clinton, NY.

Indium Corporation's Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 William D. Ashman Award at the

Indium Corporation's Greg Wade, global technical support engineer, will share his expertise at the LaserJob Technology Forum on Nov. 6 in Furstenfeld,

Indium Corporation announces that Linda Phinney has been hired as human resources project manager.  Phinney’s responsibilities include managing, planning, and coordinating human

Indium Corporation’s Sze-Pei Lim, technical manager for Southeast Asia, and Jonas Sjoberg, technical consultant for the Asia-Pacific region, will share their expertise at the 36th International

Indium Corporation’s Liyakathali Koorithodi, assistant technical manager, presented at IPC India on Sept. 24. Koorithodi’s presentation, The Second Generation Shock Resistant

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC)

Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, will share his expertise at the International Microelectronics

Indium Corporation was presented with the Surface Mount Technology Association (SMTA)’s Corporate Award on Tuesday, September 30, at the Members of Distinction Awards Ceremony at

Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise during a Surface Mount Technology Association (SMTA) Webtorial on Oct. 15

Indium Corporation will join businesses and organizations across the country on Oct. 3 in recognition of National Manufacturing Day 2014. National Manufacturing Day is designed to expand a

Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits

Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise at the Surface Mount Technology Association International's (SMTAI)Power and

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and

Indium Corporation announces the release of a revolutionary new product called EZ-Pour™ Gallium Trichloride (GaCl3). Gallium trichloride is a unique material that is sometimes difficult to use

Indium Corporation’s Pony Liao, area technical manager for Northern China, presented at the IPC Shenyang Seminar in August in Shenyang,