新闻稿

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and

Indium Corporation announces the release of a revolutionary new product called EZ-Pour™ Gallium Trichloride (GaCl3). Gallium trichloride is a unique material that is sometimes difficult to use

Indium Corporation’s Pony Liao, area technical manager for Northern China, presented at the IPC Shenyang Seminar in August in Shenyang,

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the Medical Electronics Symposium Sept. 18-19 in Portland, Ore. Dr. Lee will present The Application of

Indium Corporation’s Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany. Bloching will present

Indium Corporation recently relocated its Shenzhen office to a larger facility at, West Tower, Qiushi Center, Room 1701, Zhuzlin, ShenNan Road Central, Futian District, Shenzhen, PRC. The move

Indium Corporation announces that Adam Murling has been hired as a technical support engineer. He is based at Indium Corporation’s global headquarters in Clinton, N.Y.

Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in

Indium Corporation's Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present at the SMART Group’s seminar, Reliability and Standards in Real Life: An IPC and

Indium Corporation technology experts will share their expertise at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging

Indium Corporation’s Sehar Samiappan, area technical manager for North Malaysia, the Philippines, and Vietnam, will present at the SMTA Penang Chapter’s meeting on Aug. 21. Sehar will

Indium Corporation announces that Jian-Guo (Jeff) Luo has been hired as a research metallurgist. Luo is responsible for researching and developing lead-free low-melting solder alloys. This includes

Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept.

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the 2014 China Solder Technology Forum and Exhibitions (CSTF) Aug. 26-27 in Shenzhen, China. Dr.

Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen,

Indium Corporation’s Sze Pei Lim, technical manager – Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.

Indium Corporation announces that Andy C. Mackie, Ph.D., MSc, has been named president of the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS). IMAPS is the

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association’s International Conference

Indium Corporation will feature its new solder paste, Indium10.1, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont,