- Achieving High Reliability for Lead-Free Solder Joints - Material Considerations
Sunday, March 30, 8:30am - 4:30pm
- Future Lead-Free alloys - Meeting Challenges of Miniaturization
Wednesday, April 2, 10:15am - 11:45am - A Compliant and Creep Resistant SAC+Al (Ni) Alloy
Thursday, April 3, 9:00am - 10:00am
- Rapid RoHS Assembly Development for Large and Small Boards in an RoHS Environment
Monday, March 31, 8:30am - 4:30pm
- Assembly of Large PWBs in an RoHS 5, RoHS 5.5, and RoHS 6 Environment
Wednesday, April 2, 9:00am - 10:00am
- Improving Pb-Free Reflow Coalescence through Consistently High Solder Paste Transfer Efficiency
Tuesday, April 1, 1:30pm - 3:00pm
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