Indium Corporation's Market Manager for Thermal Interface Materials, Jordan Ross, will be presenting at Microelectronics Packaging and Test Engineering Council (MEPTEC) symposium in San Jose, CA. The theme of the symposium is called, "The Heat is On: Thermal Solutions for Advancing Technology." As technologies become more advanced, and in turn generate more heat, thermal issues continue to grow in importance. Jordan's presentation, called "Thermal Interface Materials for the Electronics Industry," discusses thermal solutions and materials to help keep consumer electronics, such as laptops, servers, and power devices in automobiles and trains, from generating too much heat and burning out. Indium Corporation will also be exhibiting their products at the trade show that runs concurrent with the symposium. Jordan manages the global initiatives for Indium's thermal management products, including sales and marketing for the Heat-Spring(R) thermal interface material. He has presented at numerous industry forums and conferences. In addition, he actively participates in interactive online communications through his Thermal Blog, which can be found at Jordan is a resident of Whitesboro, NY. MEPTEC is a worldwide membership organization that provides a forum for semiconductor packaging and test professionals to learn and exchange ideas. Members include contractors, manufacturers, and vendors from throughout the semiconductor industry. For more information about MEPTEC or the symposium, visit Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001. For more information about Indium Corporation visit or email