Indium Corporation’s Jason Chou, Area Technical Manager – Taiwan, will present at SEMICON Taiwan 2019, September 18-20 in Taipei, Taiwan.

Chou will present Challenges and Solutions in the Flip-Chip and BGA Ball-Mount Process, which examines how the increased complexity in semiconductor packaging technology creates many reliability challenges for processes and materials. These challenges include warpage caused by thinner die and packages, cleaning issues due to low standoff and microbump applications, and solder joint and wetting issues on micro Cu-pillar bumps. In his presentation, Chou will introduce some of the innovative fluxes, soldering materials, and other solutions to ensure the manufacturability and long-term reliability of advanced packages.

Chou provides technical support to Indium Corporation’s customers in Taiwan with a focus on the semiconductor industry. Chou earned his master’s degree in chemistry from National Tsing Hua University and his bachelor’s degree in chemistry from National Cheng Kung University. He has served as the group leader for the National Nano Device Laboratories in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.