Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM
April 23, 2014
Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany.
Heat-Spring® is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under repeated power cycling.
Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.
For more information about Heat-Spring® thermal interface materials, visit www.indium.com/heat-spring, or stop by to talk to any of Indium Corporation’s technical experts at PCIM, stand 7-454.