Indium Corporation's Technical Manager for Europe, Karthik Vijay, will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.

Karthik will present Engineered Solders in RF & Microwave Packages. This paper discusses how engineering unique attributes into solder preforms exponentially increases the reliability and manufacturing windows of RF and microwave packages. Examples include: Au/Sn solder frames with no trapped oxide or contaminants to achieve a reliable hermetic seal; flux-coated InAg preforms (which melt at 143°C) to achieve very low-voiding; and solder-based thermal interface materials that do not require reflow, for superior thermal management.

Karthik joined Indium Corporation in 2003. He earned his master's degree in Industrial Engineering with a specialization in Electronics Packaging & Manufacturing from the State University of New York at Binghamton. He is an SMTA-certified engineer and earned his Six Sigma Green Belt certification from Dartmouth College's Thayer School of Engineering.

For more information about IMAPS-UK RaMP RF and Microwave Packaging workshop, visit

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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