The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging. Thum will present Soldering Material Evolution for Heterogeneous Integration, which outlines trends in soldering material technology for heterogeneous integration, including solder paste, and flip-chip and ball-attach fluxes.
Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelor’s degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.
To view additional papers authored by Indium Corporation’s experts, visit www.indium.com/techlibrary.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.