Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Indium Corporation 是雷射與光學應用領域的領先焊料供應商。對於需要高熔點接模焊料的應用，金基合金是確保最佳性能和可靠性的最佳選擇。除了滿足高可靠性應用嚴苛的熱能與電氣要求外，它們還能提供最堅固的耐腐蝕與抗氧化焊點。
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the NEW Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- 高精度厚度控制
- 精確的邊緣品質
- 最佳化清潔度
- 預設華夫餅包裝方式
- 可用於金基合金
Indium Corporation 的 AuLTRA 75 是一種非共晶 AuSn 預成型解決方案 (75Au/25Sn)，設計用於改善使用鍍金層較厚的晶粒應用中的金屬間可靠性，例如用於 5G 及其他關鍵軍事和航空無線通訊的高頻、高功率 RF 功率放大器裝置的 GaN 晶粒。AuLTRA 75 可調整最終焊點成分，改善濕潤和空泡情況，有助於改善這些關鍵技術的運作。AuLTRA 產品系列還有 78Au/22Sn 和 79Au/21Sn 成分。
Indium Corporation’s AuLTRA ThInFORMS are 0.00035″-thick (0.00889mm or 8.89m) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- 短路縮小的焊料體積可抑制焊料滲入晶片，將短路風險降至最低。
- Poor thermal transferthe ultra-thin 0.00035″ preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.
A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- 所有焊料中最高的拉伸強度
- 與後續回流製程相容的高熔點
- 優異的熱傳導性
- 耐腐蝕性
Additionally, Heat-Spring is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to our indium reclaim and recycle program.
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #5017 at the show.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
