Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R
September 29, 2015
Available in both SAC and Pb-based alloys, Indium6.4R achieves superior stencil printing performance and demonstrates excellent response-to-pause.
“Indium6.4R is the recommended water-soluble paste for most applications because it outperforms other pastes in all categories,” said Glen Thomas, product manager, PCB solder paste. “This paste allows for wetting and solderability on multiple surface finishes; results in low voiding on QFNs, BGAs, and CSPs; and maintains tack over time at various humidity levels.”
For more information about Indium6.4R, including technical papers and other technical information, visit www.indium.com/indium6.4R.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.