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Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China

July 13, 2016

Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastes at NEPCON South China 2016, on Aug. 30-Sept. 1, in Shenzhen, China. 

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.

In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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