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CLINTON, N.Y., October 23, 2026 — Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA

The following press release was issued by Micron Technology on October 20, 2026, regarding its partnership with Indium Corporation®. It is republished here with permission. Original headline: Micron

CLINTON, Nueva York, 15 de octubre de 2026 — Indium Corporation®, líder del sector en soluciones innovadoras de materiales para el encapsulado de semiconductores y el montaje de componentes electrónicos, ha recibido el Premio Tecnológico de México

CLINTON, Nueva York, 9 de octubre de 2026 — Andreas Karch, director técnico regional y técnico especializado en aplicaciones avanzadas de Indium Corporation®, hablará sobre su trabajo en el desarrollo de normas industriales para

CLINTON,

CLINTON, Nueva York, 24 de septiembre de 2026 — Ryan Mayberry, ingeniero sénior de desarrollo de aplicaciones de la división Engineered Solder Materials (ESM) de Indium Corporation®, hablará sobre la soldadura con ácido fórmico y su auge

CLINTON, N.Y., October 2, 2026 — Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with

CLINTON, Nueva York, 28 de septiembre de 2026 – Como líder del sector en soluciones innovadoras de materiales para el encapsulado de componentes electrónicos, Indium Corporation® presentará sus pastas de soldadura de alta fiabilidad para

CLINTON, N.Y., September 25, 2026 – Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a

CLINTON, N.Y., September 25, 2026 — As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing

CLINTON, N.Y., September 10, 2026 — Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed

al puesto de director de Investigación y Desarrollo CLINTON, Nueva York, 3 de septiembre de 2026 — Indium Corporation ha ascendido al Dr. Hongwen Zhang al puesto de director de Investigación y Desarrollo (I+D). En este cargo, se encargará de

TAIPEI, Taiwán, 2 de septiembre de 2026 — A medida que la inteligencia artificial (IA) y la computación de alto rendimiento (HPC) siguen impulsando la innovación en el sector de los semiconductores, la industria está superando el reto

CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance

CLINTON, N.Y., August 31, 2026 — Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and

CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges

CLINTON, N.Y., August 24, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and

CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging

CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability

CLINTON, N.Y., August 11, 2026 — Innovation begins with people and—for the 14th consecutive year—Indium Corporation’s award-winning summer internship program has cultivated the next

CLINTON, N.Y., August 11, 2026 — Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications,